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Base Informations
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Name
*
E-mail
*
Solder side
Singe side（SMT+DIP）
Both side（SMIT+DIP）
The number of layers
Unlimited
Board Thickness
50*50mm——400*340mm
Quatities
Unlimited
Pad spray plating
Unlimited
The color of PCB
Unlimited
PCB split (connection mode)
Stamp holes
V-sharp cutting
Mark point
*
Required
Edge of process
*
Required
SPI solder paste test
You can choose according to your needs
Encapsulation
Minimal 01005
Pin spacing
MIN0.3mm
BGA ball diameter spacing
Minimal 0.3mm
Reflow soldering temperature
Maximum 260℃
Other message
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Special Services
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*
Email
*
Special opening of steel mesh
No need
Need(check)
Stepped steel mesh
Components Baking
No need
Need
Components Welding Flux
Recommend
Sn64%、Bi 35%、Ag 1%（）
Three Anti Paint Spray
No need
One side(50-200um)
Double side(50=200um)
Specified
Package Service
Bubble wrap
Partition packing
Board Surface Cleaning
No need
Need(Charge)
Confirm Before Shipping
No need
Take photo(check)
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SYSTEM SOLUTIONS
TECHNOLOGY PLATFORMS
Accessories
Service
About
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